2009890008
Molex
Product No:
2009890008
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
CONN HEADER SMD 8POS 1.27MM
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | Molex |
| Style | Board to Board |
| Series | Slim-Grid 200989 |
| Package | Tube |
| Features | - |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Telecommunications |
| Contact Type | Male Pin |
| Contact Shape | Square |
| Mounting Type | Surface Mount |
| Connector Type | Header |
| Fastening Type | Latch Holder |
| Number of Rows | 2 |
| Pitch - Mating | 0.050" (1.27mm) |
| Product Status | Active |
| Voltage Rating | 125V |
| Contact Material | Copper Alloy |
| Insulation Color | Black |
| Insulation Height | 0.280" (7.10mm) |
| Ingress Protection | - |
| Base Product Number | 200989 |
| Insulation Material | Liquid Crystal Polymer (LCP), Glass Filled |
| Number of Positions | 8 |
| Row Spacing - Mating | 0.050" (1.27mm) |
| Contact Finish - Post | Tin |
| Contact Length - Post | - |
| Current Rating (Amps) | - |
| Operating Temperature | -55°C ~ 105°C |
| Mated Stacking Heights | - |
| Overall Contact Length | - |
| Contact Finish - Mating | Gold |
| Contact Length - Mating | - |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 78.7µin (2.00µm) |
| Contact Finish Thickness - Mating | 2.00µin (0.051µm) |
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