ESQ-111-14-G-T
Samtec Inc.
Product No:
ESQ-111-14-G-T
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
CONN SOCKET 33POS 0.1 GOLD PCB
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | Samtec Inc. |
| Style | Board to Board |
| Series | ESQ |
| Package | Tube |
| Features | - |
| Termination | Solder |
| Applications | - |
| Contact Type | Forked |
| Contact Shape | Square |
| Mounting Type | Through Hole |
| Connector Type | Elevated Socket |
| Fastening Type | Push-Pull |
| Number of Rows | 3 |
| Pitch - Mating | 0.100" (2.54mm) |
| Product Status | Active |
| Voltage Rating | 550VAC |
| Contact Material | Phosphor Bronze |
| Insulation Color | Black |
| Insulation Height | 0.435" (11.05mm) |
| Ingress Protection | - |
| Base Product Number | ESQ-111 |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Number of Positions | 33 |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Length - Post | 0.480" (12.19mm) |
| Current Rating (Amps) | 5.7A per Contact |
| Operating Temperature | -55°C ~ 125°C |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 3.00µin (0.076µm) |
| Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
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