FI-DP58SB-VF88L-R700
JAE
Product No:
FI-DP58SB-VF88L-R700
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
CONN RCPT 58P 0.02 GOLD SMD R/A
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | JAE Electronics |
| Style | Board to Cable/Wire |
| Series | FI-DP |
| Package | Tape & Reel (TR) |
| Features | Board Guide, Solder Retention |
| Termination | Solder |
| Applications | General Purpose |
| Contact Type | Center Strip Contact |
| Contact Shape | - |
| Mounting Type | Surface Mount, Right Angle |
| Connector Type | Receptacle |
| Fastening Type | Latch Holder |
| Number of Rows | 1 |
| Pitch - Mating | 0.020" (0.50mm) |
| Product Status | Obsolete |
| Voltage Rating | - |
| Contact Material | Copper Alloy |
| Insulation Color | Black |
| Insulation Height | 0.346" (8.80mm) |
| Ingress Protection | - |
| Base Product Number | FI-DP58 |
| Insulation Material | Plastic |
| Number of Positions | 58 |
| Row Spacing - Mating | - |
| Contact Finish - Post | Gold |
| Contact Length - Post | - |
| Current Rating (Amps) | 0.5A per Contact |
| Operating Temperature | -40°C ~ 80°C |
| Mated Stacking Heights | 8.8mm |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 1.25µin (0.032µm) |
| Contact Finish Thickness - Mating | 12.0µin (0.30µm) |
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