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IW-HSKALU-CLASLR-CU03

iWave Systems

Product No:

IW-HSKALU-CLASLR-CU03

Manufacturer:

iWave Systems

Package:

-

Batch:

-

Datasheet:

-

Description:

ZU+ MPSOC SOM MODULE HEATSINK

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Product Information

Parameter Info
Mfr iWave Systems
Type Top Mount
Shape Rectangular, Fins
Width 2.953" (75.00mm)
Length 3.740" (95.00mm)
Series -
Package Bulk
Diameter -
Material Aluminum
Fin Height 1.181" (30.00mm)
Package Cooled FPGA
Product Status Active
Material Finish -
Attachment Method Bolt On
Thermal Resistance @ Natural -
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow -