PA0170-S
Chip Quik Inc.
Product No:
PA0170-S
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
MINI SOIC-8 EXP PAD STENCIL
Quantity:
In Stock : Please Inquiry
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Product Information
Parameter Info
| Mfr | Chip Quik Inc. |
| Type | Mini SOIC |
| Pitch | 0.026" (0.65mm) |
| Series | Proto-Advantage PA |
| Package | Bulk |
| Material | Stainless Steel |
| Thickness | 0.0040" (0.102mm) |
| Product Status | Active |
| Inner Dimension | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Thermal Center Pad | 0.315" L x 0.067" W (8.00mm x 1.70mm) |
| Number of Positions | 8 |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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