PA0170-S

Chip Quik Inc.

Product No:

PA0170-S

Manufacturer:

Chip Quik Inc.

Package:

-

Batch:

-

Datasheet:

Description:

MINI SOIC-8 EXP PAD STENCIL

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr Chip Quik Inc.
Type Mini SOIC
Pitch 0.026" (0.65mm)
Series Proto-Advantage PA
Package Bulk
Material Stainless Steel
Thickness 0.0040" (0.102mm)
Product Status Active
Inner Dimension 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad 0.315" L x 0.067" W (8.00mm x 1.70mm)
Number of Positions 8