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R7F701397AEABG-C#BC1

Renesas Electronics America Inc

Product No:

R7F701397AEABG-C#BC1

Package:

156-FBGA (10x10)

Batch:

-

Datasheet:

-

Description:

32BIT MCU RH850/P1X-C BGA292

Quantity:

In Stock : Please Inquiry

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Product Information

Parameter Info
Mfr Renesas Electronics America Inc
Speed 240MHz
Series RH850/P1M-C
Package Tray
RAM Size 448K x 8
Core Size 32-Bit Dual-Core
EEPROM Size 64K x 8
Peripherals DMA, POR, PWM, Temp Sensor, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
Mounting Type Surface Mount
Core Processor RH850G3M
Package / Case 156-LFBGA
Product Status Active
Data Converters A/D 16x12b
Oscillator Type Internal
Program Memory Size 2MB (2M x 8)
Program Memory Type FLASH
Operating Temperature -40°C ~ 150°C
Supplier Device Package 156-FBGA (10x10)
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V