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R7F7017113ABG-C#HC1

Renesas Electronics America Inc

Product No:

R7F7017113ABG-C#HC1

Package:

233-FBGA (15x15)

Batch:

-

Datasheet:

-

Description:

32BIT MCU RH850/F1KH

Quantity:

In Stock : Please Inquiry

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Product Information

Parameter Info
Mfr Renesas Electronics America Inc
Speed 240MHz
Series RH850/F1x
Package Tape & Reel (TR)
RAM Size 992K x 8
Core Size 32-Bit Dual-Core
EEPROM Size 256K x 8
Peripherals DMA, PWM, WDT
Connectivity CANbus, CSI, I²C, LINbus, UART/USART
Mounting Type Surface Mount
Number of I/O 174
Core Processor RH850G3KH
Package / Case 233-FBGA
Product Status Active
Data Converters A/D 38x10b, 32x12b
Oscillator Type Internal
Program Memory Size 8MB (8M x 8)
Program Memory Type FLASH
Operating Temperature -40°C ~ 105°C (TA)
Supplier Device Package 233-FBGA (15x15)
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V